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SERIAL EEPROM
Serial EEPROM Cross Reference Guide
The purpose of this document is to provide a quick way to determine the closest Microchip equivalent to Serial EEPROMs produced by other manufacturers. The cross reference section is broken down by manufacturer and lists all parts from that manufacturer, and the comparable Microchip part number. There is also a listing of manufacturer’s part numbering schemes to assist in determining the specifications of a particular part. There are subtle differences from manufacturer to manufacturer and device to device, so Microchip recommends consulting the respective manufacturer’s gadabout for specific details. Microchip provides a wide selection of Serial EEPROM devices, both from a density and a packaging standpoint, as well as several different protocols. If you are interested in a part that is not listed in this book, please refer to the Microchip data book, or contact your local distributor or sales representative for assistance. The manufacturers* included in this document are as follows: AKM Atmel Catalyst Exel ISSI Microchip Mitsubishi National Oki Philips Samsung SGS-Thomson Siemens Xicor

FIGURE 1:
XX

MICROCHIP SERIAL EEPROM PART NUMBER GUIDE
XX XX XX X / XX
Package W S P SM SN SL Blank I E = = = = = = = = = Die in wafer form Die in waffle pack PDIP Small outline .207 mil Small outline .150 mil 14-lead small outline .150 mil 0°C to +70°C -40°C to +125°C -40°C to +125°C 128 x 8 256 x 8 512 x 8 1K x 8 2K x 8 4K x 8 8K x 8 128K x 8 or 64 x 16 128 x 8 256 x 8 512 x 8 16 x 16 64 x 16/128 x 8 256 x 8/128 x 16 512 x 8/256 x 16 CMOS Low Voltage (2.5V) CMOS 1.8 Volt 2-wire 4-wire 2-wire 3-wire

Process Temperature

Special Options Memory 1K 01 2K 02 4K 04 8K 08 16 16K 32 32K 65 64K 1K 11 1K 72 2K 82 4K 92 06 256 Bit 1K 46 2K 56 4K 66 C LC AA 24 59 85 93 – – – – – – –

Process Technology

Part Number Designator

*The above trademarks are property of their respective companies.

© 1995 Microchip Technology